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grant AF252-D028

Manufacturing Scale-up of 500C Capable, Kilo-Byte Scale, Non-Volatile Memory

The grant seeks to advance high-temperature non-volatile memory (HT-NVM) technology that performs reliably at extreme temperatures, specifically 500°C and above. This involves developing 6" wafer-scale manufacturing processes for HT-NVM arrays of at least 2 kB. The project aims to address manufacturing and reliability challenges such as ON/OFF ratio variation, bit failure rates, and endurance …

The objective of this project is to mature high-temperature, non-volatile memory (HT-NVM) technology that provides reliable data retention and robust performance under extreme thermal conditions, specifically at 500°C temperatures. This program seeks 6" wafer-scale module and chip level manufact…

Funding Source

Agency: Air Force

Dates

Opportunity Released: April 23, 2025

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