R&D to grow high-quality InAsP semiconductor wafers with controlled alloy composition
This funding opportunity supports research and development to create optical-quality, compositionally uniform InAsP ternary semiconductor wafers. The work targets wafer dimensions around 20–25 mm in cross-section and over 1 mm thick, with varying alloy compositions. Note: the technical area is subject to ITAR/EAR export controls, so any involvement of foreign nationals and their planned roles …
The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EA…
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