Photonic Bump Bonds
This grant opportunity focuses on developing new technology to improve photonic integrated circuits (PICs), which are similar to electrical circuits but use light. In Phase I, the primary goal is to develop and test a method to reduce technical risks, with a preference for experimental evidence. Additionally, a preliminary proposal for Phase II should be prepared, and if extended, a proof of c…
Develop an enabler of heterogeneous photonic integrated circuits (PICs), the photonic equivalent of an electrical bump bond.
Phase I
During the base, the right angle turn method described in the proposal shall be developed, at least by simulation, to the point where the technical…
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