Scout | Photonic Bump Bonds

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Photonic Bump Bonds

This grant opportunity focuses on developing new technology to improve photonic integrated circuits (PICs), which are similar to electrical circuits but use light. In Phase I, the primary goal is to develop and test a method to reduce technical risks, with a preference for experimental evidence. Additionally, a preliminary proposal for Phase II should be prepared, and if extended, a proof of c…

Source

Agency: Department of the Navy

Dates

Opportunity Released: January 8, 2025

Keywords

photonic integrated circuits

heterogeneous PICs

bump bond equivalent

right angle turn method

insertion loss improvement

self-alignment technology

military applications

RF photonic circuits

experimental demonstration

integration losses reduction

Supporting Links

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