Photonic-electronic Panels Integration (PEPI)
Funding to develop and demonstrate a prototype photonic-electronic panel that integrates photonic integrated circuits (PICs) using high-density 3D chip-to-chip and intra-chip optical routing from DARPA’s HAPPI program. The panel-level technology aims to move beyond planar routing to enable dense connectivity among multiple photonic and electronic ICs and to provide seamless co-integration of o…
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