Scout | Develop manufacturable mixed-signal chips that operate reliably up to 800°C in harsh conditions

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Develop manufacturable mixed-signal chips that operate reliably up to 800°C in harsh conditions

This opportunity funds R&D to create a manufacturable mixed-signal integrated circuit technology designed for reliable performance in harsh environments, with an emphasis on extreme high temperatures up to 800°C. The goal is to enable mission-critical electronics that can withstand these conditions using suitable IC processes and designs.

Source

Agency: U.S. Department of Defense

Phase: PHASE I

Phase: Phase II

Phase: Phase SPII

Dates

Topic Opens: May 27, 2026

Topic Closes: June 24, 2026

Eligibility

industry:defense

Keywords

mixed-signal ic

high temperature electronics

thermal reliability

harsh environments

manufacturable technology

mission-critical

integrated circuits

Supporting Links

Documents

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