forecast DPA26BZ02-NV009

Automated Co-Design Tools for Radiation-Hardened and Secure Microelectronics

This opportunity supports research to develop automated design and integration methods for microelectronics that can both withstand ionizing radiation and improve security. The goal is to enable next-generation chips with built-in resilience and stronger protection against threats. Funds target approaches that combine radiation-hardening and security at the design level.

To develop next generation microelectronics design and integration approaches that simultaneously result in resilience to ionizing radiation and enhanced security.

Funding Source

Agency: U.S. Department of Defense
Phase: PHASE I
Phase: Phase II
Phase: Phase SPII

Dates

Topic Opens: May 27, 2026
Topic Closes: June 24, 2026

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