National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
This grant opportunity seeks proposals for research and development projects aimed at advancing semiconductor packaging technology in the U.S. The focus is on making significant progress in five key areas crucial for AI applications: improving equipment and processes, enhancing power delivery and thermal management, advancing connector technology such as photonics and RF, developing a chiplets…
Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accel…
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Awards & funding
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