Scout | Best Image Fusion for Circuit Card Assemblies

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Best Image Fusion for Circuit Card Assemblies

This grant opportunity focuses on developing a software tool that can combine and fuse images captured using various modalities (such as X-Ray, Terahertz, and Optical imaging) to produce a 3D model of a circuit card assembly (CCA). The software should effectively merge the images to eliminate artifacts like shadowing and beam hardening, enabling efficient reverse engineering of CCAs, which are…

Source

Agency: Air Force

Dates

Opportunity Released: October 3, 2023

Open for Submission: October 2, 2024

Application Window Closes: November 6, 2024

Keywords

Image Fusion

Advanced Computing

Microelectronics

X-Ray Imaging

Terahertz Imaging

Optical Imagery

Reverse Engineering

Circuit Card Assembly

Printed Circuit Board

Multimodal Image Processing

Supporting Links

Documents

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