Low-cost Longwave Bolometer Camera Fabrication Techniques
The grant opportunity focuses on developing innovative technologies and manufacturing techniques to reduce the cost of sensor payloads using resistive microbolometer technology. The goal is to create thermal sensor payloads for the Army with enhanced size, weight, power, and performance comparable or superior to current commercial offerings, but at a significantly lower unit price. Proposed so…
Source
Dates
Keywords
Supporting Links
Documents
Similar Opportunities
-
Monolithic Graphene–CMOS Broadband (UV-LWIR) Focal Plane Arrays for target detection in low-light conditions
U.S. Department of Defense
-
Compact Passive Radar
U.S. Department of Defense
-
OPEN - Proliferated Low-Altitude Detection for C-sUAS
U.S. Department of Defense
-
High Speed, Low Temperature Hyperspectral Imager for High Enthalpy Ground Testing
U.S. Department of Defense
-
Design of RoomTemperature THz and Infrared Sensing Devices Using Non-Toxic, Supply-Chain Secure Material Platform
U.S. Department of Defense
Find tens of thousands more opportunities — free
Scout accounts are free. Sign up to browse the full funding database, unlock the solicitation links and documents for this opportunity, and see how well each one fits your organization.
-
Tens of thousands of funding opportunities
Search and filter every grant and solicitation in Scout — all free, no credit card required.
-
Instant Fit Analysis
Let our grant expert AI score how well this opportunity aligns with your organization, strengths, gaps, and how to improve your chances of winning funding.
-
Source links & full documents
Jump straight to the solicitation and download every attachment.
-
Save opportunities & track deadlines
Keep the opportunities that fit in one place and stay ahead of every due date.
Already have an account? Sign In
Trusted by 500+ Happy Customers