Scout | Low-cost Longwave Bolometer Camera Fabrication Techniques

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Low-cost Longwave Bolometer Camera Fabrication Techniques

The grant opportunity focuses on developing innovative technologies and manufacturing techniques to reduce the cost of sensor payloads using resistive microbolometer technology. The goal is to create thermal sensor payloads for the Army with enhanced size, weight, power, and performance comparable or superior to current commercial offerings, but at a significantly lower unit price. Proposed so…

Source

Agency: Army

Dates

Open for Submission: April 16, 2024

Opportunity Released: October 3, 2023

Application Window Closes: June 13, 2024

Keywords

UAS

Thermal Longwave Infrared

LWIR

low-cost sensors

microbolometer

focal plane array

fabrication techniques

resistive technology

sensor payload

infrared sensing

Supporting Links

Documents

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