Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
This opportunity funds R&D to create passive thermal management materials for extreme conditions and very high power density electronics. The goal is to develop a conformal thin-film heat spreader technology that offers significant performance improvements over conventional copper heat spreaders. The work focuses on enhanced thermal resilience to better protect and cool critical microsyste…
Source
Dates
Eligibility
Keywords
Supporting Links
Documents
Similar Opportunities
-
Thermal Transport Processes
National Science Foundation
-
Engineered Microstructures for Enhanced IR Aperture Performance
U.S. Department of Defense
-
Design of RoomTemperature THz and Infrared Sensing Devices Using Non-Toxic, Supply-Chain Secure Material Platform
U.S. Department of Defense
-
Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)
U.S. Department of Defense
-
29--HEAT SHIELD,EXHAUST
Defense Logistics Agency
Find tens of thousands more opportunities — free
Scout accounts are free. Sign up to browse the full funding database, unlock the solicitation links and documents for this opportunity, and see how well each one fits your organization.
-
Tens of thousands of funding opportunities
Search and filter every grant and solicitation in Scout — all free, no credit card required.
-
Instant Fit Analysis
Let our grant expert AI score how well this opportunity aligns with your organization, strengths, gaps, and how to improve your chances of winning funding.
-
Source links & full documents
Jump straight to the solicitation and download every attachment.
-
Save opportunities & track deadlines
Keep the opportunities that fit in one place and stay ahead of every due date.
Already have an account? Sign In
Trusted by 500+ Happy Customers